TY  - BOOK
AU  - Liu, Sheng & Liu, Yong
TI  - Modeling and Simulation for Microelectronic Packaging Assembly Manufacturing, Reliability and Testing
SN  - 9780470827802
U1  - 621.381046 
PY  - 2011///
CY  - New York
PB  - John Wiley and Sons, Inc
KW  - ELN
KW  - F-10
ER  -