Liu, Sheng & Liu, Yong <br/><br/>
Modeling and Simulation for Microelectronic Packaging Assembly Manufacturing, Reliability and Testing 

 - 1st Ed. 
 - New York  John Wiley and Sons, Inc  2011 
 - xx, 564p.  25 cm. 
<br/><br/><br/>Text in English 
<br/><br/><label>ISBN: </label>9780470827802 
<br/><br/><label>Subjects--Facted Index Terms: </label><br/>ELN
<br/><br/><label>Index Terms--Genre/Form: </label><br/>F-10
<br/><br/><label>Dewey Class. No.: </label>621.381046  / LIU